ServiceUpdated on 26 July 2024
Semiconductor applications
About
We have extensive experience in machining SiC material for semiconductor applications. Less energy intensive, and with less energy loss but greater efficiency, Silicon Carbide (SiC) offers a whole range of advantages over silicon (Si) for tomorrow’s applications.
Our investment in high-precision machinery enables us to machine silicon carbide using several technologies:
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High-precision milling in already sintered silicon carbide. This enables us to obtain very precise finished parts.
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Grinding
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Polishing
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Érosion
Type
- Manufacturing
Applies to
- ICT
- Microtechnology
- Biotech and Lifescience
- Health
- Luxury & Watchmaking industry
- Energy & Environment
- Agrifood
- Aeronautics & Defence
Similar opportunities
Expertise
5-axis simultaneous HSM milling
- Agrifood
- Healthcare
- Digital & ICT
- Electronics & Optics
- Energy & Environment
- Luxury - Watchmaking
- Aeronautics & Defence
- Nano- and Microtechnologies
- Biotech, Pharma and Cosmetics
- Materials & Surface Treatment
- Industrial Equipment and Machinery
- Automotive, Transport and Logistics
Brice GRUNDISCH
Commercial at POLIS PRÉCIS
Grandfontaine, France
Service
Internal and external cylindrical grinding
- ICT
- Health
- Agrifood
- Manufacturing
- Microtechnology
- Energy & Environment
- Aeronautics & Defence
- Biotech and Lifescience
- Luxury & Watchmaking industry
Brice GRUNDISCH
Commercial at POLIS PRÉCIS
Grandfontaine, France
Expertise
5-axis simultaneous HSM milling
- Agrifood
- Healthcare
- Digital & ICT
- Electronics & Optics
- Energy & Environment
- Luxury - Watchmaking
- Aeronautics & Defence
- Nano- and Microtechnologies
- Biotech, Pharma and Cosmetics
- Materials & Surface Treatment
- Industrial Equipment and Machinery
- Automotive, Transport and Logistics
Brice GRUNDISCH
Commercial at POLIS PRÉCIS
Grandfontaine, France