Optical interconnects for photonic integration/packaging

We leverage the Two-Photon Polymerization technique with a unique process that allows fast, on-chip 3D-printing of optical interconnects to solve a variety of packaging problems. We have achieved a high control of optical confinement (single and multimode), low losses and a high freedom in topology to account for various types of interconnects: free-space, laser to waveguide (wire bonds), fiber-to-chip, fiber-arrays to waveguides...

The process can scale to wafer-level packaging with high throughputs.

We are seeking partners / customers to apply that expertise on impactful use cases.