ExpertiseUpdated on 23 September 2024
Optical interconnects for photonic integration/packaging
About
We leverage the Two-Photon Polymerization technique with a unique process that allows fast, on-chip 3D-printing of optical interconnects to solve a variety of packaging problems. We have achieved a high control of optical confinement (single and multimode), low losses and a high freedom in topology to account for various types of interconnects: free-space, laser to waveguide (wire bonds), fiber-to-chip, fiber-arrays to waveguides...
The process can scale to wafer-level packaging with high throughputs.
We are seeking partners / customers to apply that expertise on impactful use cases.
Organisation
Similar opportunities
Expertise
- Electronics & Optics
jean-charles Beugnot
CNRS Researcher and Lead of French Swiss Collegium at SMYLE
BESANCON, France
Service
Development and manufacturing of opto-mechatronical systems
- Development
- Manufacturing
- Microtechnology
- Aeronautics & Defence
Erik Althuizen
Sales Manager at Nedinsco B.V.
Venlo, Netherlands
Project cooperation
High Voltage Solar Microgenerator: demonstration partner sought
- Execution
- Technical
- Micro & Nano Systems
- Electronics & Optics
Rémy Tribhout
Founder at Phigi
Montbéliard, France