Novel electronic and photonic packaging solution

As part of our ongoing technology development efforts at Microcertec, we are on the verge of introducing new generations of electronic and photonic packaging solutions designed for ultra-high packaging of devices required for demanding applications. In this regard, we are actively seeking an industrial partner to collaborate with us on this endeavor.

If your company shares our vision for advancing packaging solutions in high-tech industries and is interested in exploring partnership opportunities, we would be delighted to discuss potential collaborations further.