Matchmaking @ 18th Silicon Saxony Day

11 Jun 2024 | Dresden, Germany

ProductUpdated on 5 June 2024

Kaijo Gold Wire Bonder FB-x26

Michael Schweigart

General Manager at Kaijo Shibuya Europe GmbH

Heidelberg, Germany

About

The Kaijo FB-x26 is a reliable wire bonder designed for larger-sized packages requiring a bonding area of up to 95 mm. It can handle either gold, copper or argentum wire and is also available as a model capable for wafer-level bonding (FB-x26BUMP).

Looking for

  • Distribution Partner
  • Wholesaler
  • End user

Applies to

  • Microelectronics system
  • Hardware

Organisation

Kaijo Shibuya Europe GmbH

Small and medium enterprise

Heidelberg, Germany

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