ProductUpdated on 11 June 2024
LidroCUT - innovative laser dicing machines
About
We build laser dicing machines to cut wafer for the semiconductor industry, that enable thinner cuts with a 0% damage rate for every wafer. Our unique innovation is the use of liquids to cool and rinse the wafers while they are cut with the laser.
Users of our cutting-edge technology reduce their costs and increases their output.
Looking for
- Distribution Partner
- Project Partner
- End user
Applies to
- Microtechnology
- Microelectronics system
- Hardware
Organisation
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