Swiss PIC - Photonic integration as a service

Swiss PIC can package photonic chips with optical fibers or micro optical systems form prototype to pilot series volumes. We do packagaging as a service and consult on packaging related aspects of the chip/system design. We are already engaged in quantum activities e.g. fiber attachement to chips for operation in cryogenic environments.

We will perform packaging for prototypes to pilot series (apprx 1-100 pcs annual volumes) and as volume increases we will assits with transfer either to in-house production with the customer or to a volume packaging provider.

We can either be a subcontractor or a project partner. We have considerable expereince with both national (Danish and Swiss), bilateral and EU projects.